| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a frame in which lead frames used for a batch molded type semiconductor device are arranged. <P>SOLUTION: A frame F is used for obtaining a resin-sealed semiconductor device by arranging each of semiconductor elements on a die pad 3 supported by a lead 2 in each lead frame 10, and batch molding these semiconductor elements to be molded, and cutting a part of grid lead L so as to leave a terminal part 5 of each lead frame 10 with a dicing saw. The semiconductor elements are separated by cutting the grid leads L of the frame F and the terminal parts 5 are formed next to each other on a sectional surface of a sealed resin and an end of a lower surface of the sealed resin, and a cavity on a side is provided near a root of each terminal part 5, which is formed into a part of the grid lead L from the cut line with the dicing saw. <P>COPYRIGHT: (C)2013,JPO&INPIT |
