发明名称 HIGH VOLTAGE MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a high voltage module having a mechanism for preventing insulation breakdown in a main functional circuit thereof by detecting partial discharge or the like generated in the gel insulation the high voltage module. <P>SOLUTION: A high voltage module comprises: a front face metal substrate 2a for mounting chips on which a semiconductor element 4 is mounted, and which is bonded to the surface of an insulation substrate 1; and a rear face metal substrate 3 having ground potential being bonded to the rear face of the insulation substrate 1, and the substrate 2a and the substrate 3 being sealed with a gel insulation 5. A front face metal substrate 21 for generating partial discharge is arranged, being separated from the front face metal substrate 2a for mounting chips, on the surface of the insulation substrate 1, the potential of the front face metal substrate 21 for generating partial discharge being the same as that of the front face metal substrate 2a for mounting chips. The position of an end part of the front face metal substrate 21 for generating partial discharge is closer to the end part of the insulation substrate 1 in relation to the end part of the rear face metal substrate 3 that opposes the front face metal substrate 21 for generating partial discharge via the insulation substrate 1. A partial discharge detecting means 31 is provided for detecting the partial discharge generated on the rear face metal substrate 3 side. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065694(A) 申请公布日期 2013.04.11
申请号 JP20110203513 申请日期 2011.09.16
申请人 FUJI ELECTRIC CO LTD 发明人 HANAOMOTE HIROTAKA;TAKANO TETSUMI
分类号 H01L25/07;G01R31/12;H01L23/12;H01L23/62;H01L25/18 主分类号 H01L25/07
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