| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etching method for selectively etching a copper layer of a workpiece which includes a metal oxide layer in addition to the copper layer. <P>SOLUTION: The etching method for selectively etching a copper layer comprises: using an etchant to treat a workpiece, provided that the workpiece has a metal oxide layer including an oxide of one or more kinds of metal selected from the group consisting of Zn, Sn, Al, In and Ga in addition to the copper layer. The etchant comprises an aqueous solution which includes: 0.1-3.0 wt.% of a cupric ion source as a copper ion; 0.1-30.0 wt.% of an organic acid having no more than 6 carbon atoms; and 0.1-30.0 wt.% of one or more kinds of nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in the ring and an amino-group-containing compound having no more than 8 carbon atoms, and has a pH of 5.0-10.5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
