<p>A wire bonded structure is disclosed. The wire bonded structure comprises: a continuous length of wire comprising a first portion for electrically coupling a bonding pad with a first electrical contact, an opposite second portion for electrically coupling the bonding pad with a second electrical contact different from the first electrical contact, and a middle portion between the first portion and the second portion. An upper part of the middle portion folded over a lower part of the middle portion so as to form a first bond between the lower part and the bonding pad and a second bond between the upper part and the lower part. The first bond substantially overlaps the second bond.</p>
