发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the printed circuit board. <P>SOLUTION: A method for manufacturing a printed circuit board of the present invention includes the steps of: preparing a base substrate; forming a circuit layer including a circuit pattern and a connection pad on the base substrate; forming a first solder resist layer including the circuit layer and having a first open part which exposes the connection pad on the base substrate; and forming a second solder resist layer including the first solder resist layer and having a second open part which exposes a part of a top face of the connection pad on the base substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065811(A) 申请公布日期 2013.04.11
申请号 JP20120050161 申请日期 2012.03.07
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE SEUNG JOO;KIM YONG ZHI;ZHANG JIN HYOK;CHOI WON
分类号 H05K3/34 主分类号 H05K3/34
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