发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the printed circuit board. <P>SOLUTION: A method for manufacturing a printed circuit board of the present invention includes the steps of: preparing a base substrate; forming a circuit layer including a circuit pattern and a connection pad on the base substrate; forming a first solder resist layer including the circuit layer and having a first open part which exposes the connection pad on the base substrate; and forming a second solder resist layer including the first solder resist layer and having a second open part which exposes a part of a top face of the connection pad on the base substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013065811(A) |
申请公布日期 |
2013.04.11 |
申请号 |
JP20120050161 |
申请日期 |
2012.03.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LEE SEUNG JOO;KIM YONG ZHI;ZHANG JIN HYOK;CHOI WON |
分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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