| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses the inclination of a semiconductor chip when a solder paste is melted and improves the reliability of joining between a semiconductor chip and an electrode plate, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device according to one embodiment includes: a rear surface electrode plate having an electrode; a semiconductor chip joined to the rear surface electrode plate by solder; and a sealing material which seals the semiconductor chip with the electrode exposed. One or more first bumps are formed on a joining surface of the rear surface electrode plate and the semiconductor chip. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013065758(A) |
申请公布日期 |
2013.04.11 |
| 申请号 |
JP20110204365 |
申请日期 |
2011.09.20 |
| 申请人 |
TOSHIBA CORP |
发明人 |
TING JIA YUNN;HATTORI SATOSHI |
| 分类号 |
H01L21/60;H01L21/56;H01L23/28 |
主分类号 |
H01L21/60 |
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