| 摘要 |
<P>PROBLEM TO BE SOLVED: To narrow a substrate arrangement interval with a secured transfer margin in a substrate holding tool for holding a plurality of substrates in a shelf shape. <P>SOLUTION: The substrate handling tool (wafer boat 3) includes a first boat 1 and a second boat 2 integrated with each other in a separable manner. Holding units 16a-16c for a wafer W1 of the first boat 1 and holding units 26a-26c for a wafer W2 of the second boat 2 are set at height positions so that the wafer W1 on the boat 1 and the wafer W2 on the boat 2 are alternately arranged. After the wafers W1, W2 are transferred to the first and second boats 1, 2 respectively, the boats 1, 2 are integrated, so that a wafer boat 3 is configured, and therefore each wafer W can be loaded on the wafer boat 3 at an arrangement interval narrower than an arrangement interval when transferring the wafer W to the first and second boats 1, 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
