发明名称 MULTI-WIRE SAW
摘要 <p>A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.</p>
申请公布号 EP1685927(B1) 申请公布日期 2013.04.10
申请号 EP20040792847 申请日期 2004.10.22
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KAWASAKI, TAKAFUMI;TSURUTA, HIROZOH;NISHIDA, HIROKAZU;MIMURA, SEIICHI;HAMAYASU, MASAYUKI;TOMINAGA, HISASHI
分类号 B28D5/00;B24B27/06;B24B57/02;B28D5/04;H01L21/304 主分类号 B28D5/00
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