发明名称 |
Die-bonding method of LED chip and LED manufactured by the same |
摘要 |
A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid-solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time, so as to perform a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110°C, and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200°C. |
申请公布号 |
EP2328192(A3) |
申请公布日期 |
2013.04.10 |
申请号 |
EP20100172857 |
申请日期 |
2010.08.16 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LIN, HSIU-JEN;LIN, JIAN-SHIAN;CHEN, SHAU-YI;LAI, CHIEH-LUNG |
分类号 |
H01L33/62;H01L33/00 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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