发明名称 |
Enhanced thermal management of 3-D stacked die packaging |
摘要 |
A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate. |
申请公布号 |
GB2495454(A) |
申请公布日期 |
2013.04.10 |
申请号 |
GB20130001231 |
申请日期 |
2011.06.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GERALD K BARTLEY;DAVID R MOTSCHMAN;KAMAL K SIKKA;JAMIL A WAHIL;XIAOJIN WEI;JIANTAO ZHENG |
分类号 |
H01L23/367;H01L23/433;H01L25/065 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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