| 摘要 |
<p>The subject matter of the present application is a curable adhesive composition having PTC characteristics after curing, comprising
(i) a reactive binder system, based on an epoxy-resin-component and a curing agent-component,
(ii) particles of a carbon modification in a range of 0.01wt % to 15.0 wt%, based on the total weight of the curable adhesive composition,
(iii) copper powder in a range of 0.5 wt% to 5.0 wt%, based on the total weight of the curable adhesive composition,
wherein the reactive binder system comprises > 70 wt% of all organic polymers of the adhesive composition.</p> |
