| 摘要 |
FIELD: nanotechnology.SUBSTANCE: invention relates to a method of obtaining a nanocomposite material for thermal and chemoresistant coatings and planar layers with high dielectric capacitivity. The method is proposed in which, as the polymer binder the poly (o-hydroxy amide) is used - a product of polycondensation of 3,3'-dihydroxy-4,4'-diamino-diphenylmethane and isophthalic acid dichloride in amide solvent, and as a filler the ferroelectric material nanopowder CTSNV-1 PbSrNaBi(ZrTi)Oat a weight ratio of poly(o-hydroxy amide): filler from 1:1.15 to 1:1.5. The ratio of components in the nanocomposite (wt %): poly(o-hydroxy amide) 6-12; filler CTSNV-1-6.9-18, solvent - the rest. Mixing of the components is carried out at room temperature without preliminary dispersion of ferroelectric filler, before applying to the conductive substrate the nanocomposite suspension is subjected to ultrasonic treatment. Films formed on the conductive surfaces are dried at 95-100°C and subsequent stepped heat processing in the temperature range of 200-350°C.EFFECT: obtained coatings are chemically stable, have a heat resistance up to 400°C, high adhesive capacity to various types of substrates and dielectric capacitivity ? of 23 to 185.1 cl, 1 tbl, 9 ex |
