发明名称 Phase change memory cell having top and bottom sidewall contacts
摘要 Memory devices and methods for manufacturing are described herein. A memory device as described herein includes a memory element and a first electrode having an inner surface surrounding the memory element to contact the memory element at a first contact surface. The device includes a second electrode spaced away from the first electrode, the second electrode having an inner surface surrounding the memory element to contact the memory element at a second contact surface.
申请公布号 US8415651(B2) 申请公布日期 2013.04.09
申请号 US20080138311 申请日期 2008.06.12
申请人 LUNG HSIANG-LAN;MACRONIX INTERNATIONAL CO., LTD. 发明人 LUNG HSIANG-LAN
分类号 H01L47/00 主分类号 H01L47/00
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