发明名称 METHODS FOR FORMING A CONDUCTIVE MATERIAL, METHODS FOR SELECTIVELY FORMING A CONDUCTIVE MATERIAL, METHODS FOR FORMING PLATINUM, AND METHODS FOR FORMING CONDUCTIVE STRUCTURES
摘要 <p>A method of forming a conductive material comprises forming at least one opening extending through an organic material and an insulative material underlying the organic material to expose at least a portion of a substrate and a conductive contact in the substrate. The method further comprises lining exposed surfaces of the insulative material, the conductive contact, and the at least a portion of the substrate in the at least one opening with a conductive material without forming the conductive material on the organic material.</p>
申请公布号 KR101251827(B1) 申请公布日期 2013.04.09
申请号 KR20117011844 申请日期 2009.11.05
申请人 发明人
分类号 H01L21/3205;H01L21/8242;H01L27/108 主分类号 H01L21/3205
代理机构 代理人
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