发明名称 |
METHODS FOR FORMING A CONDUCTIVE MATERIAL, METHODS FOR SELECTIVELY FORMING A CONDUCTIVE MATERIAL, METHODS FOR FORMING PLATINUM, AND METHODS FOR FORMING CONDUCTIVE STRUCTURES |
摘要 |
<p>A method of forming a conductive material comprises forming at least one opening extending through an organic material and an insulative material underlying the organic material to expose at least a portion of a substrate and a conductive contact in the substrate. The method further comprises lining exposed surfaces of the insulative material, the conductive contact, and the at least a portion of the substrate in the at least one opening with a conductive material without forming the conductive material on the organic material.</p> |
申请公布号 |
KR101251827(B1) |
申请公布日期 |
2013.04.09 |
申请号 |
KR20117011844 |
申请日期 |
2009.11.05 |
申请人 |
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发明人 |
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分类号 |
H01L21/3205;H01L21/8242;H01L27/108 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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