发明名称 |
Multilayer circuit substrate |
摘要 |
A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion.
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申请公布号 |
US8415565(B2) |
申请公布日期 |
2013.04.09 |
申请号 |
US20090585293 |
申请日期 |
2009.09.10 |
申请人 |
NAGASE SHIGEKI;NAKAI MOTOO;YOSHIDA KOUYA;SUMASU HIROSHI;UCHIDA NOBUHIRO;JTEKT CORPORATION |
发明人 |
NAGASE SHIGEKI;NAKAI MOTOO;YOSHIDA KOUYA;SUMASU HIROSHI;UCHIDA NOBUHIRO |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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