发明名称 |
Lead frame for semiconductor package |
摘要 |
A lead frame for providing electrical interconnection to an Integrated Circuit (IC) die. The lead frame includes a die support area for receiving and supporting the IC die and a plurality of leads surrounding the die support area. A plurality of interconnect receiving portions is formed in the die support area. The interconnect receiving portions are for providing electrical interconnection to first bumps on a bottom surface of the IC die. The leads are for providing electrical interconnection to second bumps on a surface of the IC die, the second bumps surrounding the first bumps.
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申请公布号 |
US8415779(B2) |
申请公布日期 |
2013.04.09 |
申请号 |
US201113047803 |
申请日期 |
2011.03.15 |
申请人 |
WONG TZU LING;FOONG CHEE SENG;YOW KAI YUN;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
WONG TZU LING;FOONG CHEE SENG;YOW KAI YUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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