| 摘要 |
PURPOSE: A method of manufacturing an organic light emitting device is provided to reduce the recessed part of the etching region of an organic planarization layer and the disconnection of a common electrode. CONSTITUTION: An anti-etching protection layer(30) is formed on a substrate. Electrodes are formed on the anti-etching protection layer. An organic compound layer is formed on the substrate having the electrodes. A resist layer(33) is formed on the organic compound layer. The organic compound layer which is not covered with the resist layer is removed by using a dry etching process. |
