METHODS AND SYSTEMS FOR FORMING ELECTRONIC MODULES

摘要

PURPOSE: A method and system for forming an electronic module are provided to fabricate reliable circuit boards at a low cost by effectively removing heat. CONSTITUTION: An electronic module(100) includes a circuit board(102) on which one or more electronic components(104) are mounted. The circuit board includes a metal substrate providing heat transfer in order to cool down the electronic components mounted on the circuit board. The electronic components include an LED(Light-Emitting Diode)(106) and a temperature sensor(108). An electric connector(110) is combined with the electronic module. The electric connector provides power and/or data to the electronic module. The electronic module can be used in other applications other than an LED application and forms a part of an electric connector of a wafer, a chicklet, a lead frame embedded in or on an insulator, or a contact module having a conductor, etc.