发明名称 Semiconductor device and method for manufacturing the same
摘要 According to an embodiment, a semiconductor device includes a first trench being provided in an N+ substrate. An N layer, an N− layer, a P layer, and an N+ layer are formed in a stacked manner to cover the first trench. The semiconductor device includes second and third trenches. The P+ layer is formed to cover the second trench. The trench gates are formed to cover the third trenches.
申请公布号 US8415711(B2) 申请公布日期 2013.04.09
申请号 US201113234061 申请日期 2011.09.15
申请人 KITAGAWA MITSUHIKO;KABUSHIKI KAISHA TOSHIBA 发明人 KITAGAWA MITSUHIKO
分类号 H01L29/66 主分类号 H01L29/66
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