发明名称 Multi-chip package and method of operating the same
摘要 A multi-chip package includes a plurality of memory chips for performing a content addressable memory (CAM) read operation in response to a command signal for the CAM read operation and an address signal for selecting the memory chips and a controller for outputting the command signal and the address signal to the memory chips and controlling the sequence of the CAM read operations for the memory chips.
申请公布号 US8416639(B2) 申请公布日期 2013.04.09
申请号 US201113176812 申请日期 2011.07.06
申请人 KANG WON KYUNG;SK HYNIX INC. 发明人 KANG WON KYUNG
分类号 G11C8/00 主分类号 G11C8/00
代理机构 代理人
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