发明名称 |
BONDED MEMBER MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING BONDED MEMBER |
摘要 |
PURPOSE: An apparatus and a method for manufacturing a bonded member are provided to prevent the relative difference between substrates even if one substrate is thin. CONSTITUTION: A mounting unit of a resin layer forming means loads a first substrate(11). A coating unit(22) of the resin layer forming means spreads adhesive resin(13) on the first substrate. An ultraviolet irradiator(31) of a semi-hardening means(30) irradiates an ultraviolet ray to a resin layer(13). A light blocking unit(32) of the semi-hardening means blocks the ultraviolet ray for the peripheral end part(14) of the resin layer. A second substrate(12) is adhered to the first substrate by using a roller unit. |
申请公布号 |
KR20130035901(A) |
申请公布日期 |
2013.04.09 |
申请号 |
KR20120106258 |
申请日期 |
2012.09.25 |
申请人 |
ORIGIN, ELECTRIC COMPANY LIMITED |
发明人 |
KOKAJI HIDEYUKI;YAMAGUCHI KOJI |
分类号 |
G02F1/1333;B05C11/02 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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