| 摘要 |
PURPOSE: A stacked sensor package is provided to reduce a malfunction by rapidly discharging heat from stacked semiconductor chips to the outside. CONSTITUTION: A second package(500) includes a semiconductor chip, a heat discharge metal panel, a second package body, and a second external electrode(520). The heat discharge metal panel discharges heat to the outside. The second package body includes a second signal line. The second external electrode is formed outside the second package body. The second external electrode is exposed to the outside. |
