SEMICONDUCTOR PACKABE MANUFACTURING METHOD

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to prevent a void by heating and pressing underfill materials in a chamber of a low pressure state or a vacuum state. CONSTITUTION: A package substrate(10) is provided to a chamber. A bonding pad(15) is formed on the package substrate. Underfill materials(50) are provided to the package substrate. A semiconductor chip(20) is loaded on the underfill materials. The semiconductor chip is heated and pressed by a heating plate(60).