METHOD OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for forming a connection bump of a semiconductor device is provided to prevent a defect due to a flatness problem by positioning the uppermost surfaces of a connection bump and a dummy connection bump with the same level. CONSTITUTION: A photoresist pattern(120) with open patterns is formed. Pillar layers(114) are formed in the open patterns by a first electroplating process. A solder layer(116) is formed on the pillar layers by a second electroplating process. The photoresist pattern is removed. A reflow process is performed on a semiconductor substrate(100) to form a breakdown solder layer and a solder bump.