| 摘要 |
PURPOSE: A semiconductor package is provided to secure an excellent electrical property by inserting a semiconductor chip into a sidewall groove. CONSTITUTION: A first multilayer connection part(100a) is arranged on a substrate. The first multilayer connection part includes a first sidewall groove(140h). A second multilayer connection part(100b) faces the first sidewall groove. The second multilayer connection part includes a second sidewall groove(140h'). A semiconductor chip(200) is inserted between the first side wall groove and the second sidewall groove. |
