MULTILAYER PRINTED CIRCUIT BOARD WITH INTERSTITIAL VIA HOLE STRUCTURE FOR REDUCED PARASTIC CAPACITANCES

摘要

PURPOSE: A multilayer printed circuit board with an interstitial via structure with reduced parasitic capacitance is provided to enable a user to easily design a substrate by using an interstitial via hole. CONSTITUTION: A via plating body(110) includes a top pad and a bottom pad. A first metal plate(120) is parallel to one of the top pad and the bottom pad and includes a hole in a normal direction to one of the top pad and the bottom pad. A first dielectric(130) is arranged between the first metal plate and one of the top pad and the bottom pad. A strip line(140) is horizontally connected to one of the top pad and the bottom pad.