| 摘要 |
PURPOSE: A photosensitive resin composition is provided to have good finger sensing dryness, electroless gold-plating resistance, and electroless tin-plating resistance. CONSTITUTION: A photosensitive resin composition comprises an acid-modified photosensitive epoxy resin, non-sensitive carboxylic acid resin, and liquid phase bifunctional epoxy resin. The non-sensitive carboxylic resin has a weight average molecular weight of 10,000-30,000 and an acid value of 120 mgKOH/g or more. The photosensitive resin composition additionally includes kaolin. A cured film is formed by curing the photosensitive resin composition. A printed wiring board has the cured coating film. |
