发明名称 |
Semiconductor device having thermal endurance and method of manufacturing the same |
摘要 |
There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders. |
申请公布号 |
US8415801(B2) |
申请公布日期 |
2013.04.09 |
申请号 |
US20100794012 |
申请日期 |
2010.06.04 |
申请人 |
OGURA MASAMI;TAKAYANAGI TAKAHITO;YAMADA YUKO;KATO JUN;MASUDA TSUGIO;AIBA TSUKASA;TAKANO FUMITOMO;HONDA MOTOR CO., LTD. |
发明人 |
OGURA MASAMI;TAKAYANAGI TAKAHITO;YAMADA YUKO;KATO JUN;MASUDA TSUGIO;AIBA TSUKASA;TAKANO FUMITOMO |
分类号 |
H01L23/488 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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