| 摘要 |
A photosensitive resin composition and a dry film photoresist using the same are provided to show excellent process stability and yield and to ensure excellent chemical resistance as well as resistance against developer, plating solution and etchant. A photosensitive resin composition comprises: a binder resin representing a copolymer of (meth)acrylic acid and (meth)acrylic acid ester; polyimide; photo-polymerizable monomers having ethylenically unsaturated bonding; and a photo-polymerizable initiator. The weight-average molecular weight of the polyimide is 10,000~150,000. The content of the polyimide is 2.5-35wt% on a solid basis. |
