发明名称 THE LIGHT EMITTING DEVICE PACKAGE, THE METHOD FOR MANUFACTURING THE SAME AND THE LIGHT EMITTING SYSTEM
摘要 PURPOSE: A light emitting device package, a manufacturing method thereof, and a lighting device are provided to prevent warpage by forming a protrusion in a lead space filled with resin materials. CONSTITUTION: A first lead frame is separated from a second lead frame in a cavity. The first and second lead frames include a plurality of leads. The lead separately protrudes to the outside of a body(210). At least one light emitting device(120) is arranged in the cavity. A protrusion(212) is formed between the plurality of leads.
申请公布号 KR20130035775(A) 申请公布日期 2013.04.09
申请号 KR20110100303 申请日期 2011.09.30
申请人 LG INNOTEK CO., LTD. 发明人 KIM, GAM GON
分类号 H01L33/62;H01L33/48 主分类号 H01L33/62
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