| 摘要 |
PURPOSE: A wafer processing method is provided to perform a wafer separation process for cutting a wafer along a street of a reformed layer into devices. CONSTITUTION: A reformed layer is formed along a street(21) in a wafer(2). A chuck table for adsorbing the wafer releases the wafer. The wafer is divided into individual devices by cutting the street of a reformed layer. The rear surface of the divided wafer is grinded to remove the reformed layer.
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