| 摘要 |
PURPOSE: An adhesive composition is provided to minimize the generation of burrs while exhibiting excellent high temperature adhesive property, to prevent die slip defects during a bonding or molding process, and to ensure excellent workability and adhesion. CONSTITUTION: An adhesive composition comprises an epoxy resin and filler. The filler is alumina or layered silicate. The epoxy resin has 50-100°C of a self softening point before curing. The epoxy resin is a mixed resin of a bifunctional epoxy resin and a polyfunctional epoxy resin. The alumina is at least one selected from the group consisting of a-alumina,γ-alumina, diaspore, boehmite, hydragillite and bayerite. An adhesive film comprises a base film(10) and an adhesive layer(20) which is formed on the base film and contains a hardening material. |
