WIRELESSLY COMMUNICATING AMONG VERTICALLY ARRANGED INTEGRATED CIRCUITS (ICS) IN A SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for wirelessly communicating with integrated circuits which are vertically arranged in a semiconductor package is provided to communicate with other components by using a multiple access transmission scheme. CONSTITUTION: A semiconductor wafer(100) includes integrated circuits. The integrated circuits are formed on a semiconductor substrate(104). Functional modules of a first group are formed on a fabrication layer. Functional modules of a second group are vertically arranged. A conductive element is combined with the fabrication layers of a first arrangement and a second arrangement.