| 摘要 |
PURPOSE: An ingot cutting apparatus is provided to minimize the deformation of a cut silicon wafer by constantly maintaining the tension of a wire. CONSTITUTION: An ingot(104) is loaded on a holder. A transfer unit(102) transfers the ingot in a wire direction. The wire cuts the ingot transferred by the transfer unit. A wire guide moves the wire. A tension guide moves a roller(107) in a wire guide direction and constantly maintains a distance between a wire contact surface of the ingot and the roller when the ingot is moved. |
