Structure and manufacture method for multi-row lead frame of semiconductor package

摘要

PURPOSE: A structure and a manufacture method for a multi-row lead frame of a semiconductor package are provided to improve productivity and reduce manufacturing costs since a carrier member is not removed completely. CONSTITUTION: A structure and a manufacture method for a multi-row lead frame of a semiconductor package is comprised of the steps: coating a photoresist on a lead frame thin sheet(ST1); patterning the lead frame thin sheet(ST2); patterning the both side of lead frame at the same time or in order; plating the patterned lead frame thin sheet(ST3); exfoliating the photoresist(ST4); and etching the lead frame thin sheet(ST5).