发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a plurality of external terminals are arranged on an exterior surface of a body part, which achieves increase in insulation distance between the external terminals without increase in size of the body part and increase in the number of components. <P>SOLUTION: At least one of a plurality of external terminals 12 includes a notch 17 notched at a part facing another external terminal. The notch 17 allows a screw insertion hole 16 of the at least one external terminal 12 to be opened toward the other external terminal. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013062406(A) 申请公布日期 2013.04.04
申请号 JP20110200497 申请日期 2011.09.14
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 MURAMATSU KENTARO;MORINAGA YUJI;SATO HIROKI
分类号 H01L23/34;H01L23/28 主分类号 H01L23/34
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