| 摘要 |
<p>The purpose of the invention is to provide a bonding device that is capable of bonding at high speed without measurement of a bonding point height before a search operation or before bonding. The invention comprises: a confocal point optical system mounted on a bonding arm capable of swinging in the up/down direction, said confocal point optical system detecting the focused focal point of a bonding point positioned on a surface of a part to be bonded; a bonding tool that bonds and is integrally mobile with the bonding arm; and a position detection means that detects the position of the bonding tool. Control is provided so that the bonding tool descends a specified distance (focused focal point reference descent amount), from a bonding tool position that the position detection means detected during the descent of the bonding tool, said bonding tool position being detected by means of focused focal point detection by the confocal point optical system, to a preset bonding point, and stops on the bonding point.</p> |
