| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film-like adhesive that can improve connection reliability in the connection between a semiconductor element and a support member. <P>SOLUTION: This film-like adhesive 1 in one embodiment includes (a) a thermosetting component containing 6-20 mass% of an epoxy resin having ≤80°C softening point and ≤90 s gel time at 150°C, and 35 to 50 mass% of an epoxy resin with ≥150 s gel time at 150°C; (b) a high molecular weight component having 3 to 15% crosslinkable functional group in a monomer ratio, 100,000-800,000 weight-average molecular weight and -50 to 50°C Tg; and (c) an inorganic filler, wherein the content of the high molecular weight component is 30 to 100 pts.mass based on 100 pts.mass thermosetting component, and the content of the inorganic filler is 10 to 60 pts.mass based on 100 pts.mass thermosetting component. <P>COPYRIGHT: (C)2013,JPO&INPIT |
