发明名称 ROTARY DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a rotary deposition apparatus which inhibits turbulent flow from occurring in the flow of a material gas even if a deposition substrate is rotated at a speed higher than the speed of the current deposition apparatus. <P>SOLUTION: A rotary deposition apparatus 1 includes: a reaction container 10 which includes a rotor 20 having a susceptor 21 including a substrate placement part 21W, on which a deposition substrate W is placed, on an upper surface 20T and having a diameter larger than the deposition substrate W; a rotative power supply mechanism 23 supplying rotative power to the rotor 20; and a material gas supply mechanism supplying a material gas G to the deposition substrate W placed on the susceptor 21 from above the susceptor 21. At least a part of an external region of the substrate placement part 21W in the susceptor 21 is covered by a cover member 30. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013062376(A) 申请公布日期 2013.04.04
申请号 JP20110199812 申请日期 2011.09.13
申请人 TOYOTA MOTOR CORP;TOYOTA CENTRAL R&D LABS INC 发明人 ITO TAKAHIRO;NAGAI KENICHIRO;NAKAJIMA KENJI;OZAWA TAKAHIRO;INAGAKI MASAHIDE;MAKINO SOICHIRO
分类号 H01L21/205;C23C16/455;C23C16/458 主分类号 H01L21/205
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