| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a through electrode substrate which improves the manufacturing efficiency and reduces the manufacturing cost. <P>SOLUTION: In a manufacturing method of a through electrode substrate, recessed parts 112a, 112b, 112c are formed on a first surface of a substrate 110, and an insulation resin layer 113 is disposed so as to cover openings of the recessed parts on the first surface of the substrate. Conductive bumps 211a, 211b, 211c are formed on a conductive member 210, and the substrate and the conductive member are disposed at positions where the conductive bumps face the recessed parts through the insulation resin layer. The conductive member is moved close to the substrate to cause the conductive bumps to penetrate through the insulation resin layer. Then, the conduct bumps are placed in contact with bottom surfaces of the recessed parts, and the substrate and the conductive member are joined to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
