| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling mechanism and a cooling method which quickly and uniformly cools substrates after heat treatment in a batch type heat treatment apparatus heating the multiple substrates, and to provide a heat treatment apparatus which includes the cooling mechanism. <P>SOLUTION: A substrate cooling mechanism includes: a cylindrical heat shielding member 30 which moves between an insertion position where the heat shield member 30 is inserted between a substrate holding member 15 and heating means 12 in a processing chamber 11 and a lead-out position where the heat shielding member 30 is led out from the insertion position and shields radiant heat to substrates W after heat treatment; and an air cooling port 21 disposed at the exterior of the processing container 11. The heat shielding member 30 is provided so that two half-cylindrical members 31 are integrated with or separated from each other in the lead-out position, and moves between the lead-out position and the insertion position with the half-cylindrical members 31 integrated. An outer surface of the heat shielding member 30 is formed by a material having a relatively low radiation factor, and an inner surface of the heat shielding member 30 is formed by a material having a relatively high radiation factor. <P>COPYRIGHT: (C)2013,JPO&INPIT |
