发明名称 POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS
摘要 A positive resist composition comprising a polymer having carboxyl groups substituted with an acid labile group having formula (1) exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a reduced acid diffusion rate, and forms a pattern with good profile, minimal edge roughness, and etch resistance. In formula (1), R1 and R2 each are alkyl, aryl, or alkenyl, which may contain oxygen or sulfur, R3 is fluorine or trifluoromethyl, and m is an integer of 1 to 5.
申请公布号 US2013084527(A1) 申请公布日期 2013.04.04
申请号 US201213614527 申请日期 2012.09.13
申请人 HATAKEYAMA JUN;HASEGAWA KOJI;SHIN-ETSU CHEMICAL CO., LTD. 发明人 HATAKEYAMA JUN;HASEGAWA KOJI
分类号 C08F220/68;C08F224/00;C08F228/04;C08F228/06;C08F234/02;G03F7/004;G03F7/20 主分类号 C08F220/68
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