Sensor component e.g. gas sensor component integrated in e.g. ball grid array package, has conductive layer that is made to contact with sensor chip by electrical contacts of conductive layer

摘要

#CMT# #/CMT# The sensor component (20) has sensor chip (100) arranged on base layer (300). The sensor chip is electrically connected to conductive layer. The conductive layer is made to contact with sensor chip by electrical contacts of conductive layer. A polymer material (350) is partly arranged in the component, such that an aperture is formed on the sensitive side (110) of sensor chip. #CMT# : #/CMT# An independent claim is included for method for manufacturing sensor component. #CMT#USE : #/CMT# Sensor component e.g. gas sensor component, pressure sensor component, and impact sensor component (all claimed) integrated in embedded wafer level ball grid array (eWLB) package and ball grid array (BGA) package mounted on mounted on printed circuit board. #CMT#ADVANTAGE : #/CMT# The small sized and robust sensor component robust is manufactured easily and efficiently at low cost and at high productivity rate. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic cross-sectional view of the sensor component. 20 : Sensor component 100 : Sensor chip 110 : Sensitive side of sensor chip 300 : Base layer 350 : Polymer material.