This power module is provided with: a sealed body in which a conductor plate on which a semiconductor chip is mounted is sealed by a resin such that a heat dissipating surface of the conductor plate is exposed; a heat dissipating member disposed so as to face the heat dissipating surface; and an insulating layer disposed between the sealed body and the heat dissipating member. The insulating layer has a laminated body which is a lamination of a ceramic thermal spray film impregnated with a resin for impregnation and a resin film for adhesion into which a filler with good thermal conductivity is mixed and which is provided so as to contact the heat dissipating member and at least the entire region of the heat dissipating surface, and a stress relaxation resin part provided in a gap between the heat dissipating member and sealed body so as to cover the entire periphery of the edge parts of the laminated body.
