| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device and a manufacturing method of the same, which improve reliability in manufacturing. <P>SOLUTION: A semiconductor light-emitting device 10 comprises: a chip substrate 1; a first terminal electrode 2a and a second terminal electrode 2k arranged on the chip substrate 1; a reflection case 5 arranged so as to surround an outer edge of a top face of the chip substrate 1; a semiconductor light-emitting element 3 arranged on the first terminal electrode 2a via an AuSn eutectic layer; a bonding wire 4 connecting the semiconductor light-emitting element 3 with the second terminal electrode 2k; and a phosphor layer 6 arranged on the inside surrounded by the reflection case 5, in which light-emitting phosphors 61 and 62 are mixed and dispersed in a translucent resin. And a manufacturing method of the semiconductor light-emitting device 10 is provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
