| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency package that allows arrangement of a capacitive pattern at a package end and arrangement of a GSG probe pattern, and to provide terminals for the high-frequency package. <P>SOLUTION: A high-frequency package 1 includes: a conductor base plate 200; a cavity 12 that is disposed on the conductor base plate 200 and in which a semiconductor chip is installed; a first substrate 100 that is disposed on the conductor base plate 200 and surrounds the cavity 12; an input-side capacitive electrode pattern C1 that is disposed at a package input end on the first substrate 100; a first GSG probe pattern GSG1 that is disposed between the package input end and the cavity 12; and an input-side transmission line 24a that connects the input-side capacitive electrode pattern C1 and the first GSG probe pattern GSG1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
