THREE-DIMENSIONAL MOUNTING DEVICE

摘要

Provided is a three-dimensional mounting device that can further improve throughput in the manufacturing of semiconductor devices and also prevent a lowering of quality in the semiconductor devices that are manufactured. In a three-dimensional mounting device (11), a transport tray (16) has eight inside trays (16a) each including a disposing surface (16aa) and transports eight laminated chips (21) each of which is disposed on each of the disposing surfaces (16aa). A chamber (27) accommodates all of the inside trays (16a), and each of the plurality of inside trays (16a) is mounted on a respective stage of a plurality of lower stages (28) inside the chamber (27). Each of a plurality of chucks (29) is provided to correspond one-to-one with a respective laminated chip (21) disposed on a disposing surface (16aa) inside the chamber (27), and each lower stage (28) and each of the plurality of chucks (29) is moved such that the space between each lower stage (28) and each of the plurality of chucks (29) is shortened.