| 摘要 |
A resin composition comprises (a) a polyphenylene oxide of formula <FORM:1110195/C3/1> where n is at least 100, R is hydrogen or a hydrocarbon, halohydrocarbon, hydrocarbonoxy or halohydrocarbonoxy radical, and R1 and R11 are the same as R or are halogen atoms; and (b) a polyamide having a melting point of at least 350 DEG F. The polyamide improves the flow properties of the polyphenylene oxide and may be present in an amount of 0.1 to 25% by weight of the total composition. In examples, a polyhexamethylene adipamide and a polycaprolactam are incorporated in a poly-(2,6-dimethyl - 1,4 - phenylene oxide). Polystyrene, polyolefins and mineral oil may be added.
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