| 摘要 |
PURPOSE: A method for forming a contact of a 3D laminate memory array is provided to reduce processing costs and steps by forming step type contacts with different depths once regardless of the number of layers. CONSTITUTION: A plurality of semiconductor layers(10) with a step protrusion part are formed on a substrate. A first hard mask material layer is formed on a first interlayer dielectric layer. A plurality of contact hole patterns(32) are formed by etching the first hard mask material layer. A second interlayer dielectric layer fills the plurality of contact hole patterns. A second hard mask material layer is deposited on the front side of the substrate. A plurality of contact holes(70) are formed by anisotropically etching the first and second interlayer dielectric layers. |
