| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which allows formation of fine wiring with reduced occurrence of warp. <P>SOLUTION: A wiring board 1 has a structure in which a plurality of wiring layers 11, 21, 31, 42, 51, 61 and a plurality of insulation layers 20, 30, 40, 50, 60 are stacked. At least one insulation layer 40 among the stacked insulation layers includes an insulation layer 40A having a reinforcement, which is formed so as to cover a wiring pattern 31b of the lower wiring layer 31, and an adhesion layer 41A which is superposed on the insulation layer 40A, has higher adhesion with a metal film than the insulation layer 40A and is thinner than the insulation layer 40A. In addition, at least one wiring layer 42 among the stacked plurality of wiring layers includes via wiring 42a which is connected with the lower wiring layer 31 through the insulation layer 40A and the adhesion layer 41A, and a wiring pattern 42b formed on the adhesion layer 41A. <P>COPYRIGHT: (C)2013,JPO&INPIT |
